Carbon Fiber Thermal Interface Compound

Interfacial thermal resistance is a major contributor to the temperature gradients existing in satellite systems, causing higher temperatures at the electronic heat sources and larger radiators to provide lower reject temperatures. Large thermal resistance accompanies even microscopic interfacial gaps, since heat conduction is interrupted, particularly under the vacuum conditions of space. This project will investigate high conductance interface compounds that use high thermal conductivity vapor-grown carbon fibers for the reduction of interfacial impedance at joints in structures and electronic compounds. Unlike ordinary heat sink compounds that rely on powder additives to lower resistance, the carbon fibers offer continuous conduction paths that potentially enable orders of magnitude better performance. Phase I will employ electrostatic means of achieving the desired fiber orientation and compliant fibers that connect uneven surfaces forming the interface. Fiber positioning and the interaction of candidate carrier materials will be investigated.