Panoramic Image Translation of Microelectronic Assemblies

Many inspection criteria for microelectronics and surface mount device manufacturing processes require a 360 degree view of the component. Due to the limitation of traditional 2D sensor array technologies such as machine vision and laser dimensional measurement equipment, multiple views of the chip and its fillets must be taken for flaw detection and analysis. These methods require intensive image processing and is time consuming. High Speed Panoramic Inspection System (HSPIS) combines coherent image guide technology, structured illumination, panoramic image translation algorithm, machine vision and computer interface technologies into a system that "unfolds" a 360 degree view of an object into a 2D image array. This technique has two major benefits: (a) it improves current automated inspection speed by at least 400% and, (b) a portable or downloadable Panoramic Image Translation Function Library consisting of microelectronics flaw detection routines will be developed and available for other vision systems. With the support of Brunswick, this technique will be applied (Tech-Transfer) to surface inspection of composite launch tubes and miniaturized pressured vessels as well. The HSPIS will be integrated as an automated inspection system which can inspect all sides of a component in a 30 milliseconds time frame. This system will have the intelligence to identify, locate and document the flaws with that time frame. Simpex will integrate and demonstrate the performance of this inspection system, using actual samples, to the Government representatives and guests.