Micromachined, Three-Dimensionally Integrated RF or RF-Optoelectronic Circuit Components

The objective of this Small Business Technology Transfer (STTR) project is to develop three-dimensionally integrated packages for mixed DC/RF and optical inputs using micromachining techniques. There are many optoelectronic device designs that have showngreat promise in the research laboratory, but have demonstrated degraded response once packaged. The proposed effort will develop advanced packaging methods that are complementary to chip-level electronic and photonic packaging. The proposed genericpackage will demonstrate the feasibility of a three dimensional integrated package capable of driving high speed electronics and optics. The test package will be fabricated and evaluated with a passive test chip housing RF and photonic waveguidestructures. Computer simulation will be utilized to gain a thorough understanding of the package performance, and a comprehensive set of design rules will be developed to aid future designs. The proposed STTR effort will introduce a new generation of highperformance package designs for optoelectronic devices. The concepts and designs will be applicable to a wide range of components including optical modulators. The outcome of the project will have a major impact on high speed optical communication systemsfor both military and civilian communications.