MICROELECTRONIC 3-D SYSTEM ARCHITECTURE: INTERCONNECTION OF MULTICHIP MODULES USING VERTICAL-CAVITY SURFACE-EMITTING LASERS

RESEARCHERS ARE INTERCONNECTING MULTICHIP MODULES USING VERTICAL-CAVITY SURFACE-EMITTING LASERS (VCSELS) AS OPTOELECTRONIC INTERCONNECTS AND DESIGNING A MICROELECTRONIC INFORMATION PROCESSING SYSTEM (MIPS). THE EMPHASIS IS ON: (1) PHYSICALLY REALIZABLE COMPUTING SYSTEMS AND METHODS FOR THEIR DESIGN, AND (2) CORRESPONDING HARDWARE SUCH AS: OPTOELECTRONIC DEVICES/COMPONENTS, INTEGRATED OPTICS, OPTICAL SWITCHING DEVICES, AND OPTICAL INTERCONNECTIONS. THE PROJECT IS: (1) DEMONSTRATING THE INTERCONNECTION OF VERTICALLY STACKED PLANES USING ELECTRICALLY ADDRESSED CVSELS, MICROOPTICS, AND DETECTORS; (2) USING THESE RESULTS DO DESIGN A 3-D MIPS COMPRISING OPTOELECTRONICALLY INTERCONNECTED MULTICHIP MODULES (MCMS); AND (3) OUTLINING A PROTOTYPE MIPS TO PROVE THE FEASIBILITY OF NEAR TERA OPERATION/SEC (E.G., TERAFLOP/SEC) PERFORMANCE. NUMEROUS SCHEMES FOR THE INTERCONNECTION OF MCMS OR WAFERS ARE UNDER DEVELOPMENT. THE FIRST APPROACH ATTEMPTED TO INTERCONNECT SEVERAL VERTICALLY STACKED WAFERS WITH METALLIC AIR-BRIDGE INTERCONNECTS. HOWEVER, THE ADVENT OF OPTOELECTRONIC COMPONENTS REVEALED A MORE PROMISING AND POWERFUL ALTERNATIVE TO ALL-ELECTRONIC INTERCONNECTS KNOWN AS OPTOELECTRONIC INTERCONNECTS. THE REVOLUTIONARY VCSEL APPROACH TO OPTOELECTRONIC INTERCONNECTION OF MCMS IS UNRIVALED (NY E.G., OPTICAL MODULATORS) FOR SPEED, FUNCTIONALITY, INTEGRABILITY, AND MANUFACTURABILITY.