Ultra Low-Loss Optoelectronic Packaging

Conventional optoelectronic packaging technologies failed to provide low-loss coupling among various optoelectronic devices that are pivotal for BMDO-mission-related tasks. To bridge different effective apertures of various optoelectronic devices are the major bottleneck needs to be overcome. Radiant Research, Inc., proposes a drastically new idea to solve this problem by introducing a mode-matched waveguide to significantly alleviate the existing coupling losses among various optoelectronic components. Based on our in-depth investigation. the compression-molded polymer waveguide proposed herein is the only solution to bridge huge dynamic range of different optoelectronic device depths. There is no other waveguide fabrication method that is capable of providing the waveguide depth needed to cover the required dynamic range of depth which may vary from few um to hundreds of um. The idea is aimed at providing a cost-effective, reliable and low-loss optoelectronic packaging. All the transparent optical polymeric (TOP) materials are either thermosetts or thermoplastics. Both can be molded into a specific shape as desired. It is therefore best-suited to integrate different optoelectronic devices with a different device size and spacing. In phase I we will demonstrate an optoelectronic packaging consisting of a multi-mode fiber and a single-mode waveguide with one order of magnitude improvement in packaging losses.