SBIR Phase I: Of Ultra-High-Speed Electronic Integrated Circuits, Interconnects, and Dielectric Ribbons

This Small Business Innovation Research Phase I Project will describe a new way to use specially designed low loss dielectric ribbons (with attenuation as much as 100 times less than that of a conventional circular polymer rod at Ka band), made with either alumina, silicon, InP or GaAs as fundamental building blocks for electronic integrated circuits or interconnects. The absence of metallic structures in the ribbon approach provides the possibility of high power carrying capability. This technology offers the possibility of directly incorporating active devices with a low-loss transmission medium, provides the foundation for ultra-high-speed integrated circuits. Major commercial markets include the automobile, semiconductor, computer, and satellite industries.