SBIR/STTR Research Award

DEVELOPMENT OF NOVEL CURING TECHNIQUES FOR THERMOSETTING POLYMERS AND ADHESIVES

Award identifier 59f1d047419f47d1acec6afcda7bad11a1e3f9f3fed7920659286c4483387b45Awarding agency Department of Defense · Army

Award amount

$298,776

Program and phase

SBIR · Phase II

Award year

1991

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Award details

Awarding agency
Department of Defense
Branch
Army
Recipient company
Springborn Materials Science
Proposal award date
Not reported
Contract end date
Not reported
UEI
Not reported
Solicitation number
Not reported
Topic code
Not reported

Research abstract

THE MAIN OBJECTIVE OF THIS PROGRAM IS TO DETERMINE THE FEASIBILITY OF DEVELOPING A THERMOSETTING POLYMERIC ADHESIVE AND CURING METHOD THAT WILL NOT REQUIRE CURE CYCLES IN AN OVEN OR A PRESS AT ELEVATED TEMPERATURES AND PRESSURES. THE PROGRAM WILL ENCOMPASS A STUDY OF THE RESPONSIVENESS OF THERMOSETTING EPOXY ADHESIVES TO DIELECTRIC, INDUCTION, ULTRASONIC, ULTRE-VIOLET, AND INFRARED ELECTROMAGNETIC ENERGIES. ENERGY SENSITIZERS WILL BE INVESTIGATED FOR IMPROVING THE ADHESIVE'S RESPONSIVENESS TOWARDS ENERGIES SHOWING LIMITED EFFECTS. A FINAL EVALUATION OF THE PHYSICAL PROPERTIES RELATING TO THE CURE OF THE ADHESIVE WILL BE USED TO DETERMINE FEASIBILITY OF DEVELOPING A NOVE CURING THERMOSETTING POLYMERIC ADHESIVE.

Technology keywords

Not reported

Agency intelligence

Department of Defense

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