SBIR/STTR Research Award
DEVELOPMENT OF NOVEL CURING TECHNIQUES FOR THERMOSETTING POLYMERS AND ADHESIVES
Award amount
$298,776Program and phase
SBIR · Phase IIAward year
1991Award details
- Awarding agency
- Department of Defense
- Branch
- Army
- Recipient company
- Springborn Materials Science
- Proposal award date
- Not reported
- Contract end date
- Not reported
- UEI
- Not reported
- Solicitation number
- Not reported
- Topic code
- Not reported
Research abstract
THE MAIN OBJECTIVE OF THIS PROGRAM IS TO DETERMINE THE FEASIBILITY OF DEVELOPING A THERMOSETTING POLYMERIC ADHESIVE AND CURING METHOD THAT WILL NOT REQUIRE CURE CYCLES IN AN OVEN OR A PRESS AT ELEVATED TEMPERATURES AND PRESSURES. THE PROGRAM WILL ENCOMPASS A STUDY OF THE RESPONSIVENESS OF THERMOSETTING EPOXY ADHESIVES TO DIELECTRIC, INDUCTION, ULTRASONIC, ULTRE-VIOLET, AND INFRARED ELECTROMAGNETIC ENERGIES. ENERGY SENSITIZERS WILL BE INVESTIGATED FOR IMPROVING THE ADHESIVE'S RESPONSIVENESS TOWARDS ENERGIES SHOWING LIMITED EFFECTS. A FINAL EVALUATION OF THE PHYSICAL PROPERTIES RELATING TO THE CURE OF THE ADHESIVE WILL BE USED TO DETERMINE FEASIBILITY OF DEVELOPING A NOVE CURING THERMOSETTING POLYMERIC ADHESIVE.
Technology keywords
Not reported