LOW-COST DEPOSITION OF HIGH TEMPERATURE SUPERCONDUCTOR FOR AVIONIC AND OTHER SCREENING APPLICATIONS

THE OBJECTIVE OF THE PROPOSED PROGRAM (PHASE I) IS TO DEVELOP THE PROCESS OF PLASMA FLAME DEPOSITION OF HIGH TEMPERATURE SUPERCONDUCTING MATERIALS FOR USE IN SCREENING AND ELECTROMAGNETIC CAVITY APPLICATIONS. IN ORDER TO REDUCE POST-DEPOSITION ANNEALING TIME AND EXPOSURE OF HIGH TEMPERATURE, A NOVEL ANNEALING PROCESS WILL BE EMPLOYED. THIS PROCESS INVOLVES THE USE OF AN ACTIVE SPECIES OF MOLECULAR OXYGEN, SPECIFICALLY DELTA SINGLET OXYGEN, AT CONCENTRATIONS OF UP TO 80%. IT IS ANTICIPATED THAT THE PLANNED REDUCTION IN TIME AT TEMPERATURE OF THE ANNEALING PROCESS WILL FAVORABLY LIMIT INTERATION BETWEEN THE SUBSTRATE AND THE DEPOSITED HIGH TEMPERATURE SUPERCONDUCTOR. ADDITIONALLY, A PLASMA DEPOSITION/FABRICATION PROCESS FOR HOLLOW STRUCTURES WILL BE DEVELOPED - INVOLVING THE USE OF SACRIFICIAL MANDRELS. IT IS EXPECTED THAT THE TECHNOLOGY DEVELOPED DURING PHASE I OF THIS PROGRAM WILL BE APPLICABLE TO WORK WITH MOST OXIDE SUPERCONDUCTORS CURRENTLY UNDER DEVELOPMENT BY OTHER INVESTIGATORS.