Miniaturized Active Vibration Mitigation Technology

CSA Engineering proposes the design, development, and qualification of a family of modular miniaturized active vibration mitigation subsystems that would then be combined for use in jitter and vibration mitigation for BMDO supported technologies such asGBI, KKV, AIT, SBL, etc. The subsystems are conceived such that they can be implemented as a drop-in solution late in a project's development or baselined early in a mission's planning stage. Such technology is needed to protect devices sensitive tojitter and line-of-sight deviations such as sensors, optical trains, cameras, and infrared sensors, or to prevent disturbances from noise generating equipment from escaping into the structural bus. In Phase I, effort will concentrate on proving thefeasibility of certain key components of the overall concept, mainly miniaturized electronics and a staged actuator. This proposed technology directly addresses the effort needed to make active solutions more acceptable to end customers, i.e, they will besmaller and use less power. In Phase II, the mount subsystems will be miniaturized further, expanded to enable two-axis lateral, and full three-axis active control. The technology will also support a wide range of commercial applications in the fields ofaeronautics, semiconductor manufacturing, and life sciences.The proposed technology will enable dramatically improved active vibration mitigation technology in the areas where it matters most to end customers: reduced size, cost and power draw. The technology will support and enable a wide range of advancedBMDO/DOD missions currently being developed and tested. Markets for the developed technology are expected at the system level and for the individual subsystems such as miniaturized electronics and actuators. The proposed technology will also support awider range of commercial applications in the field of aeronautics, semiconductor manufacturing and inspection, and life sciences.