SBIR/STTR Research Award
Materials for Printing Electronic Components
Award amount
$98,998Program and phase
SBIR · Phase IAward year
1998Award details
- Awarding agency
- Department of Defense
- Branch
- Defense Advanced Research Projects Agency
- Recipient company
- Partnerships Limited, Inc.
- Proposal award date
- Not reported
- Contract end date
- Not reported
- UEI
- Not reported
- Solicitation number
- Not reported
- Topic code
- Not reported
Research abstract
The objective of this Phase I program is to demonstrate the technical feasibility of functional materials that can be applied by a simple print-and-heat process at temperatures below 400 C to create electronic components on a variety of substrates. The technology to be demonstrated is an extension of the existing PARMOD process from metallic conductors to resistors, capacitors and inductors based on oxide phases. A successful result in Phase I will permit demonstration of producing complete electronic circuits by a maskless, computer-driven tool in Phase II. Both conductors and functional components will be applied in a multilayer structure to create a selected circuit of military interest on low-cost polymer-based substrates.
Technology keywords
Not reported