Mechanically Flexible Active Silicon Chips and Systems

Using innovative chip thinning technology married with recently available packaging technology, this effort will produce Mechanically Flexible Multifunctional Active Silicon chips. By thinning pre-fabricated silicon chips down to the order of microns, bonding and encapsulating them in flexible polyimide materials; the resulting crystalline silicon chip can be flexed like a piece of paper where all the components ? the wiring, passives, and active silicon chips ? can be rolled, bent, and folded to virtually any shape and size.A Mechanically Flexible Active Silicon System is the next generation of MCM-D technology. Evolving from Chip-on-Flex to Chip-IN-Flex where the active silicon chips are themselves mechanically flexible, this technology will enable countless space, mobile, sensing, and advanced architecture systems for NASA.