Polyguinoline Dielectrics as Low Dielectric Packaging

POLYQUINOLINE DIELECTRICS AS LOW DIELECTRIC CONSTANT PACKAGING MATERIALS OFFER MANY ADVANTAGES OVER OTHER ORGANIC POLYMERS (EG. POLYIMIDES) AND INORGANIC MATERIALS. KEY PROPERTIES INCLUDE LOW DIELECTRIC CONSTANT (2.6-2.8), VERY LOW MOITURE UPTAKE (0.15%), AND HIGH THERMAL STABILITY. MANY ELECTRONICS APPLICATIONS REQUIRE PHOTOIMAGEABLE DIELECTRICS AND IN MOST APPLICATIONS FABRICATION IS SIMPLIFIED WITH THE USE OF PHOTOIMAGEABLE POLYQUINOLINE FOR ELECTRICS APPLICATIONS. ADVANCED PACKAGING SYSTEMS SUCH AS MULTI-CHIP MODULES (MCM'S) NOW RELYING ON EXPENSIVE PLASMA ETCHING TECHNOQUES COULD SWITCH TO LOW COST WET ETCHABLE POLYQUINOLINES. WET ETCH METHODS ARE PREVALENT IN JAPAN BUT ALMOST NON-EXISTENT IN THE U.S. IT IS IMPERATIVE THAT U.S. MCM PRODUCERS DEVELOP WET ETCH TECHNIQUES IN ORDER TO COMPETE WITH LOWER COST PRODUCTS FROM OVERSEAS.