SBIR/STTR Research Award
Very High Thermal Conductivity Micro-Filaments
Award amount
$64,825Program and phase
SBIR · Phase IAward year
1992Award details
- Awarding agency
- Department of Defense
- Branch
- Missile Defense Agency
- Recipient company
- Xemet, Inc.
- Proposal award date
- Not reported
- Contract end date
- Not reported
- UEI
- Not reported
- Solicitation number
- Not reported
- Topic code
- Not reported
Research abstract
Electronic cooling, micro-chip cooling and advanced materials all suffer from thermal limitations. XEMET micro-filaments used individually or embedded into matrix materials will create new families of products focused on these high-value-added markets. For electronic applications a single XEMET micro-filament 50 microns in diameter is capable of carrying 10 to 20 watts. Embedded into a matrix, they will remove 4 TO 10 times the heat loads limiting wafer scale applications. Formed into MMC's for high temperature advanced materials applications, they will carry in excess of 100 watts each, allowing structural materials to operate in environments which exceed their melting point.
Technology keywords
Not reported