DEVELOPMENT OF VENTRICLE ASSIST DEVICE (VAD) ACTUATOR

Not Available This program proposes a fresh look at the tape-wrapped carbon-phenolic (TWCP) fabrication process used in the manufacture of reentry body heatshields with the objective of finding their variations to the existing processing or new processes which will result in significantly reduced costs. Since the TWCP process was developed in the 1970's, there have been significant advances in composite processing methodology such that large complex parts can be made near net shape by semi-automated techniques resulting in improved uniformity and reproducibility. Despite these advances, a new process has not been qualified for TWCP becuase of the high cost of qualification. The dwindling supply of qualified rayon fiber affords an excellent opportunity to develop a new SOTA process. This program will quantify cost reductions afforded by advances in fabrication technology to the existing process as wll as from alternatives and prioritize them on a cost/performance basis. The Phase I effort will assume low thermal conductivity PAN-based carbon fibers as rayon replacement materials. Phase I will produce a plan for Phase II, to evaluate high priority alternative heatshield fabrication process(es). This program will validate the cost reduction estimates and include hardware fabrication for test evaluation.