Thermal Management Techniques for Bonded Electronic Components

In sufficient dissipation of heat generated by high-power electronic components via the bonded structure loweres the performance and service life of the package. Polycomp Technologies, Inc. proposes to develop novel die-attach adhesives that arereworkble, highly electrically and thermally conductive, and environmentally stable. By the use nanomaterials, such properties can be achieved without adversely affecting the processibility of the adhesive. Commercial electronic industries are seeking newthermally and electrically conductive die attach adheives that can be used to bond dissimilar materials. The novel adhesives will enable the fabrication of electronic packages that are environmentally stable with increased ability for repair and rework.