A New Architecture for Three-Dimensional MCM Packaging Using Microprisms and Imaging Optical Tunnels

Multichip modules are intended for use in high-performance electronic systems. One major limitation of packaged MCMs using electrical interconnects is the limited operating speed caused by relatively long electrical interconnect lines. Ohmic power losses, long delay times, and sensitivity to electromagnetic interference are some disadvantages. Optoelectronic interconnection, with speed and bandwidth independent of interconnection idstance, is a potential replacement for electrical interconnects, particularly suitable for board-to-board three-dimensional MCM packaging as it will provide non-physical contact interconnection paths. Physical Optics Corporation proposes a new three-dimensional interconnection architecture for MCM packaging using waveguide modulators, microprisms (MP), and imaging optical tunnels (IOT). the new MP-IOT interconnect technique offers advantages for board-to-board MCM packaging: high speed and wide bandwidth interconnects (> GHz), lower power consumption at high data rates, low clock skew, low propagation loss, high packaging density, large fanout density, non-physical contact board-to-board inteconnects, low crosstalk, and reduced system sensitivity to EMI. The Phase I goal is to develop a small interconnect prototype and to demonstrate the feasibility of the proposed MP-IOT interconnect concept. Phase II research will produce a multi-element, fully integrated, MP-IOT-based MCM prototype system.