Compact, Polymer-Based IC Package with Integrated Passives and Active Cooling

"Development of a polymer-based semiconductor chip package integrated with embedded passives and active cooling is proposed. Integration will increase overall system performance, reduce the PWB real estate consumed in support of each chip, as well as reduceassembly costs and improve reliability. OCI envisions the use of a polymer insulated metal substrate onto which layers of resin-coated foil with conductive-paste-filled microvias and layers of copper foil bearing thick film capacitors and resistors arelaminated to produce a high speed, functionally integrated electronic package. To directly remove heat from the chip and keep the embedded passives within their optimum operating temperature range, integration of thermoelectric cooling, either frompatternable pastes or by building the package directly on a commercial thermoelectric module, is also envisioned. The proposed approach integrates the high performance and reliability of thick film passive devices with conventional copper wiring and thespace savings of solid microvias. A metal substrate, in addition to providing integral thermal spreading and dissipation, will provide a flat surface to facilitate etching of very fine features. OCI's solution differs from other approaches in that itintegrates a metal substrate, resin-coated foils, solid microvia, embedded passives and active cooling technology directly into the package. Competing polymer-package integration approaches lack integrated thermal management and tend to focus on standardparallel processing of multiple circuit substrates with plated through holes to interconnect circuit layers and access the embedded passives. OCI's solution will provide substantially higher circuit density, lower parasitics, and excellent thermalmanagement - particularly in harsh environments. Successful completion of this research will provide solutions to a wide array of military and commercial electronic devices/products. Integrated passives will facilitate miniaturization of electronic products and integrated electronic cooling will improvereliabili