SBIR/STTR Research Award
MICROMACHINING GAAS WAFERS
Award amount
$255,000Program and phase
SBIR · Phase IIAward year
1987Award details
- Awarding agency
- Department of Defense
- Branch
- Air Force
- Recipient company
- Lehrer-pearson Inc.
- Proposal award date
- Not reported
- Contract end date
- Not reported
- UEI
- Not reported
- Solicitation number
- Not reported
- Topic code
- Not reported
Research abstract
MICROMACHINING GAAS WAFERS HOLD PROMISE OF FLATTER WAFERS, WITH BETTER PARALLELISM (UNIFORMITY OF THICKNESS), WHICH IN TURN PROMISES BETTER YIELD AND CIRCUITRY REPEATABILITY. MOREOVER, THE SAME PROCESS CAN BE USED TO PROVIDE BETTER CONTROL OF POST-CIRCUITRY THINNING. EXPERIMENTS WILL BE CONDUCTED TO IMPROVE SURFACE FINISH AND REDUCE SUBSURFACE DAMAGE. HANDLING AND CHUCKING TECHNIQUES WILL BE DEVELOPED TO REDUCE HANDLING HAZARDS AFTER THINNING.
Technology keywords
Not reported