Heat Sink System for High Performance Electronics

This proposal describes a research and development project to develop a heat spreader/heat sink that can be used as a cold plate or core ce is expected to be significantly better than current state-of-the-art heat spreaders made of the diamonds or composites such as TC1050. At the same time, the cost of the proposed system is expected to be well below those of TC1050-based systems. During the Phase I studies, experimental studies will be done to fabricate and test the performance of a prototype device in order to verify the concept. In addition, work will be done to identify interface requirements, manufacturing, cost and related issues. Based on the results, designs will be developed for long-term applications.