SBIR/STTR Research Award
MULTI-GIGAHERTZ BANDWIDTH HIGH PINOUT DENSITY WAFER PROBE
Award amount
$49,866Program and phase
SBIR · Phase IAward year
1989Award details
- Awarding agency
- Department of Defense
- Branch
- Defense Advanced Research Projects Agency
- Recipient company
- Cascade Microtech, Inc.
- Proposal award date
- Not reported
- Contract end date
- Not reported
- UEI
- Not reported
- Solicitation number
- Not reported
- Topic code
- Not reported
Research abstract
A MEMBRANE TYPE WAFER PROBE IS PROPOSED WHICH, AT THE END OF PHASE II, WILL ACHIEVE TRANSMISSION OF SIGNALS FROM TESTER TO DIE WITH LOW ABBRATIONS FOR A 100 PS RISETIME. CAPABILITIES WILL INCLUDE LOW-IMPEDANCE GROUND AND POWER CONTACTS, WITH LSI-LEVEL NUMBERS AND DENSITIES OF SIGNAL LINES. PHASE I WORK WILL DETERMINE THE DESIGN PARAMETERS NECESSARY FOR THESE GOALS THROUGH A SEQUENCE OF CALCULATIONS, SCALE MODELLING, AND PROTOTYPE FABRICATION AND TESTING.
Technology keywords
Not reported