Inexpensive Components Corporation

The objective of this program is to develop Standard Module and Interface specifications, for the principal components, of a market-driven, cost-targeted, Thermal Imager. The imager is based on the Honeywell Inc.(HI), Uncooled, Ir Si microbolometer, 2-Dimensional Focal Plane Array (FPA) and the existing Infrared Components Corporation (ICC) commercial Standard FPA Module. Beginning with the constraints to satisfy the home security market, Standard Modules and Interfaces will be defined for various system scenarios. These will then undergo trade analysis to achieve designs that are projected to be very low cost in very high volume production. A Standard FPA Module, adaptable through Standard Electronic and Optical Modules, and common to a variety of low cost Thermal Imagers, will be prototyped and tested. HI 2-Dimensional Si Microbolometer FPAs will be integrated into these prototype Standard FPA Modules. This is to evaluate the feasibility of the Standard Interface design(s) and specifications, and demonstrate a total product legacy to very low cost/high volume manufacture.