GLASS CERAMIC-DIAMOND COMPOSITES FOR ELECTRONIC PACKAGING APPLICATIONS

FOR ELECTRONIC PACKAGING APPLICATIONS, THE THREE DESIRABLE PROPERTIES OF AN INSULATING CERAMIC SUBSTRATE ARE: HIGH THERMAL CONDUCTIVITY, THERMAL EXPANSION MATCH WITH THE DEVICE AND LOW DIELECTRIC CONSTANT. WHILE SOME MONOLITHIC CERAMICS SHOW PROMISE, AN ALTERNATIVE APPROACH IS TO DESIGN AND FABRICATE A COMPOSITE MATERIAL WHICH WILL HAVE THESE PROPERTIES. WE PROPOSE A NEW MATERIAL: GLASS CERAMIC MATRIX-DIAMOND PARTICLE COMPOSITES. SINCE DIAMOND HAS VERY HIGH THERMAL CONDUCTIVITY AND LOW THERMAL EXPANSION COEFFICIENT, WE EXPECT THAT GLASS CERAMIC MATRIX-DIAMOND COMPOSITES WILL HAVE THE DESIRABLE PROPERTIES OF A SUBSTRATE. IN PHASE I RESEARCH, WE INTEND TO INVESTIGATE THE FEASIBILITY OF FABRICATION OF THESE COMPOSITES. THE COMPOSITES WILL BE FABRICATED BY SINTERFORGING OF POWDER COMPACTS OF GLASS MATRIX-DIAMOND PARTICLES. THE THERMAL, DIELECTRIC AND MECHANICAL PROPERTIES OF THE COMPOSITES WILL BE DETERMINED AS A FUNCTION OF VOLUME FRACTION OF DIAMOND PARTICLES IN THE MATRIX.