SBIR/STTR Research Award
Microsystems Vacuum Packaging
Award amount
$99,000Program and phase
SBIR · Phase IAward year
2003Award details
- Awarding agency
- Department of Defense
- Branch
- Defense Advanced Research Projects Agency
- Recipient company
- MICROASSEMBLY TECHNOLOGIES, INC.
- Proposal award date
- Not reported
- Contract end date
- Not reported
- UEI
- Not reported
- Solicitation number
- Not reported
- Topic code
- Not reported
Research abstract
Resonant MEMS sensors offer high sensitivity for military applications, and their development will address billion dollar markets for automotive, aerospace, robotics and condition-based maintenance applications. However, high-performance resonant MEMSrequire expensive vacuum packaging for high-Q and intimate electrical integration although MEMS and CMOS processes are quite incompatible. The proposed project addresses the largest cost component for resonant MEMS, often >95% of costs. MicroAssembly'svacuum packaging capability has demonstrated high yields on wafer and die scale. This bonding process has been successfully used to seal MEMS in vacuum. The Phase I work will focus on achieving long vacuum lifetimes on a chip-level.
Technology keywords
Not reported