COST IMPROVEMENT FABRICATION METHODS FOR RADAR T/R MODULES

AN INNOVATIVE MICROWAVE PACKAGING TECHNOLOGY IS PROPOSED. THIS PACKAGING PROVIDES COST EFFECTIVE PRODUCTION AND TESTING. IMPROVED ELECTRICAL CHARACTERISTICS, MECHANICAL DURABILITY OVER CONVENTIONAL PACKAGING WILL BE PROVIDED. IN THIS PROJECT SEVERAL EMERGING TECHNOLOGIES ARE UTILIZED. MICROELECTRONIC HYBRID FABRICATION TECHNIQUE IS EMPLOYED. LOW PRESSURE PLASMA TORCH TECHNOLOGY WILL BE USED FOR DEPOSITION OF A1N AS A INSULATOR WITH EXCELLENT THERMAL CONDUCTIVITY. IN ADDITION THE A1N LAYER WILL BE USED AS A DECOUPLING CAPACITOR TO COUNTERACT THE LIN INDUCTANCES. FOR COST EFFECTIVENESS AND TO IMPROVE INDUCTANCE PROBLEMS TAB TECHNOLOGY IS SUBSTITUTED FOR CONVENTIONAL WIRE BONDING. THIS TECHNOLOGY WILL EASILY LEND ITSELF TO TESTING OF THE SYSTEM PERFORMANCE. IN ADDITION MANY IMPEDANCE MATCHING PROCEDURES CAN BE IMPLEMENTED WITH UTILIZATION OF THIS TECHNOLOGY. ALSO "AIR BRIDGES" CAN COST EFFECTIVELY BE FABRICATED WITH THIS TECHNOLOGY. THE PLASMA TORCH TECHNOLOGY WILL ENABLE US TO GROW THICK CONFORMAL LAYER OF A1N AT A VERY HIGH DEPOSITION RATE, WHICH IS MORE ECONOMICAL AND COST EFFECTIVE. IN THE SAME VACUUM SYSTEM A THIN LAYER OF DENSE A1N IS REACTIVELY SPUTTERED ON TOP OF THE PREVIOUS LAYER TO COVER THE PIN HOLES OF THAT LAYER. THE ABILITY TO EFFECTIVELY DISSIPATE HEAT IN THIS PACKAGING SHOULD SIGNIFICANTLY IMPROVE ITS RELIABILITY. THE SUBSTRATE CORE MATERIAL IS COPPER CLADDED INVAR WHICH WILL ADD TO THE HEAT DISSIPATION CAPABILITY, MECHANICAL DURABILITY AND REDUCE WEIGHT OF THE SYSTEM.