Hand Held High Resolution Imagin Devices for Aircraft Substructures

Eikos LLC will evaluate two approaches, millimeter waves and opto-acoustics, for locating edges and holes in substructure that are hidden under exterior panels and skins during aircraft assembly. These devices will work in a camera-like fashion to allow non-destructive remote imaging. Eikos has developed promising approaches to both techniques that have the potential to be low cost and easy to use tools during aircraft assembly. Both approaches will yield hand-held, high resolution, imaging devices based on inexpensive commercially available components. Both systems are based on innovative laser and nonlinear optical configurations designed by Eikos. Based on commercially available components, the Phase I prototypes will be easily assembled and tested. The most promising candidate system will be recommended for development in Phase II. This system will be further developed with the use of private-sector funding and the Fast Track Phase II program. The end of theis SBIR program will result in the delivery of a working prototype.