Small Lot Repair/Manufacture of Microcircuit Boards by Laser Deposition

The final prototype of the Microcircuit Board Repair apparatus will be capable of laying down or lifting metal strips with micrometer dimensions. Under real time computer control, the translation stages will be fully automated or manually controlled. The end user will monitor the process in real time using a camera attached with the source. Laying down the metal lines will be done using Laser Chemical Vapor Deposition (LCVD) and lifting the lines will be done using laser ablation. Phase I of this project will entail demonstrations of LCVD and sub-micron translation using computer control. It will also involve a literature search to determine the best metal and mixture of the metal halide gas to date. Literature searches will also be done to determine the commonly used material and how they differ using the LCVD process. Environmental concerns will be studied in Phase I with a more complete study to be done in Phase II using a chemist from Oklahoma State University.The final Phase I report will provide significant evidence from the demonstrations and the literature research for Phase II funding.