Nanomaterials for High Performance Thermal Packaging

Modern electrical systems operate with high power consumption and as a result of the power dissipation generate much heat that can damage components and limit application lifetime. Even with the specialty materials currently used in both the electronic package as well as the mounting buss for heat dissipation, most systems still require additional cooling mechanisms. ANI proposes adaptation of a high thermal conductivity carbon aluminum composite and a Cu nanoparticle based solder to generate next generation high thermal capacity electronic packaging which will reduce or eliminate the need for external cooling loops. This new material is expected to show increased performance over traditional direct bonded copper substrates. Commercial Applications and Other Benefits: Successful development of our novel thermal management solution will provide increased options for power electronics and overall thermal management solutions.