Time Space Position Information GPS INS Instrumentation (TSPIGII) Package

The development of a subminiature instrumentation package utilizing state-of-the-artglobal position system (GPS) and inertial navigation system (INS) technologies toobtain Time Space Position Information (TSPI) is proposed. The package measuring50mmX50mmX25mm consists of three modules. It has a inertial module with a flat chipinertial measurement device, a GPS module with a processor and an interface modulewith power management. The package has a connector for an antenna, a subminiature25-pin connector for configuration management, testing and power input, and ahigh-speed serial I/O port.The Phase I effort includes a feasibility analysis, trade-off analyses of componentmodules, breadboard fabrication and testing of GPS and IMU modules, true scalefabrication of the package enclosure. The effort will yield a recommended design ofthe instrument package to be developed in Phase II. In addition to be employed in the conventional TSPI applications, the SGI will findapplications in commercial navigation in aircraft, boats, and other vehicles. Furtherreductions in cost and size will lead to applications in sports, medicine,automobile, oil industry, optics stabilization, toys, etc.