Functional and Diagnostic Analysis of Circuits using Laser or Electron Beam Scanning Technology

The proposed research addresses the issue of integrated circuit (IC) failuredetection using laser beam technology for the examination of internal chipstructures, combined with the use of imaging techniques to interpret the laserimages. Our approach begins with the analysis of the chemical properties of theIC substrate with respect to opacity to laser emissions at various operationalparameters (e.g., frequencies, modulation, etc.), and is followed by thespecification of requirements for IC laser illumination and capture of lasergenerated images based upon these results. Multiresolution analysis and otherimaging analysis techniques are then used to examine the laser images to determinethe existence of artifacts that may relate to the properties and characteristics ofIC failure. These artifacts are then categorized for diagnostic use. If successful,the results of this research would form the basis for an entirely new method ofdetecting IC failures and degraded performance that are otherwise undetectable usingpresently available testing techniques.Benefits include the creation of a new approach for testing ICs and methods foridentifying previously undetectable hard and degraded failure modes. Commercialapplications include production test of ICs and circuit modules.