SBIR/STTR Research Award

Evaluation of Integrated Wall Systems Incorporating Electrochromic Windows

Award identifier e0abda73b12038f8b98e90c348b0e2c1328f41dd3801bd199b693c78a022091bAwarding agency Department of Energy

Award amount

$100,000

Program and phase

SBIR · Phase I

Award year

1999

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Award details

Awarding agency
Department of Energy
Branch
Not reported
Recipient company
SAGE ELECTROCHROMICS,INC.
Proposal award date
Not reported
Contract end date
Not reported
UEI
Not reported
Solicitation number
Not reported
Topic code
Not reported

Research abstract

Not Available High power microwave and millimeter-wave amplifiers for wireless communication base stations, wireless local area networks, digital radio, and airborne or space-based applications like phased array radar, satellites communications are increasingly utilizing solid state power amplifiers. Nitride based wide bandgap semiconductors have demonstrated potential (theoretically proposed and experimentally demonstrated) for realization of high power, high frequency transistors, due to their superior material properties and the existence of the AlGaN/GaN heterostructure. This is due to the combination of the wide-band gap and heterostructure in the AlGaN/GaN system, where high voltage, high current and low on-resistance can be simultaneously achieved, resulting in high power-high efficiency operation. In this program, WiTech proposes to develop a reliable high power AlGaN/GaN HEMT based microwave/millimeter wave device and circuit technology, capable of operating under harsh environments such as high temperatures up to 300*C. The demonstration vehicle shall be an efficient, linear power amplifier circuit operating at X-band, with ~5 W power level at > 20 Volts (Phase I) and 20-50 W power levels at 28 Volts (Phase II). Operation at 28 Volts eliminates the need for dc-dc voltage conversion in certain airforce applications, improving system efficiency and reducing cost. Further, WiTech will investigate components for GaN MMICs (Metal Resistors, MIM Capacitors, Spiral Inductors, CPW Transmission Line Wiring). Flip-chip technology for thermal management will be addressed in the option plan with a view of achieving higher throughput and lower cost. Power amplifier circuits on SiC and Sapphire substrates will be compared based on a performance/cost analysis in Phase II.

Technology keywords

Not reported

Agency intelligence

Department of Energy

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