Solder-Plating Process Control

At CSL, Inc. the Sequential Electrolytic Reduction Analysis equipment will be optimized for both board and component manufacturing processes. Six manufacturers will be suppling product during this project. Our approach to optimization will be through applying SERA technologies to all board and component processes that directly relate to the solderability issues. CSL, Inc. will use a four phase approach with the objectives being correlation, redesign, multiple board analysis, and evaluation of component plating processes. By optimizing the technology through these four phases, we will be able to maximize the system areas of application as a process control tool. Using industry partners and an analytical laboratory approach, we can then maximize the exposure to the industry through a multidimensional test matrix. Understanding the type and level of oxides present throughout the metallization processes will lead to improved product quality. To give todays manufacturers cost affective process control tools that will improve product reliability can only save our industry uncountable millions od dollars and allow these manufacturers to better compete in the world market. CSL, Inc.'s use of both military approved and automotive electronic manufacturers will allow a more expedient commercialization of this technology.