Advanced Dielectric Nanocomposites

This Small Business Innovation Research (SBIR) Phase I project aims to develop three-phase dielectric nanocomposite films for embedded capacitor. The proposed three-phase nanocomposite dielectric materials may demonstrate high dielectric constant, low loss, low leakage current, and high breakdown voltage while maintaining the adhesion, processability, and flexibility of polymers, which may enable embedded capacitors for printed circuit board applications. The broader societal/commercial impact of this project will be the potentials to meet the projected trends in electronic device miniaturization and produce better dielectric materials for the next generation capacitors. Currently, the majority of the printed circuit board surface is occupied by passive components, with most of these being capacitors. If the capacitors can be embedded in the board itself, the size of the device can be reduced significantly with additional benefits in performance, functionality, and cost. In addition, this project may also provide a new dielectric material with high dielectric constant and low leakage current to meet the requests of high energy density capacitors.