Affordable Lightweight Electronic Packaging Materials

The objective of the proposed program is to develop and demonstrate a low-cost, high thermal conductivity, low mass density material for use in electronic packaging. Target material characteristics are: less than aluminum heat sinks, thermal conductivity at least 200 W/m-k, and mass density less than aluminum. To address this objective, Cast Metal Composites, Inc. will produce lightweight, high thermal conductivity, graphite reinforced aluminum and/or polymer matrix composite materials using our unique high pressure infiltration process. Two or three composite materials will be selected for sample manufacture based on the projected cost of the materials and on analytical modeling and computer simulation results. The effect of variations in reinforcement type, volume fraction, orientation, and properties on the resultant composite material properties will be studied. Candidate reinforcement materials will include discontinuous (milled or chopped) pitch graphite fibers, vapor grown carbon filaments, and two-dimensional and three-dimensional porous carbon-carbon materials. During Phase I, coupon samples of the composite materials will be produced and physical properties will be measured. This work will support the development of detailed material development plan that will be pursued in Phase II. A final report will be submitted at the end of the Phase I effort.