INTEGRATION OF SIMULATED AND MEASURED VIBRATION RESPONSE OF MICROELECTRONICS

METHODS OF INTEGRATING ANALYTICAL AND EXPERIMENTAL TECHNIQUES TO PREDICT ELECTRONIC DEVICE RESPONSE TO VIBRATION AND SHOCK LOADINGS ARE PROPOSED. UNIQUE NONINTRUSIVE EXPERIMENTAL TECHNIQUES, COUPLED WITH ADVANCED DIGITAL SIGNAL PROCESSING ALGORITHMS, WILL BE USED TO VERIFY FINITE ELEMENT MODEL INPUT DATA, MODELING ASSUMPTIONS, BOUNDARY CONDITIONS, AND TO DETERMINE MATERIAL PROPERTIES SUCH AS DAMPING VALUES. METHODS OF COMBINING EXPERIMENTAL AND ANALYTICAL DATA BASES TO DEVELOP VERIFIED TEST/ANALYSIS HYBRID MODELS WILL ALSO BE DEFINED. PHASE I WILL DETERMINE THE FEASIBILITY OF COMBINING TEST DATA WITH ANALYTICAL SIMULATIONS FOR RESPONSE PREDICTIONS OF ELECTRONIC DEVICES AND WILL EXPERIMENTALLY DEMONSTRATE THE FEASIBILITYOF USING NONINTRUSIVE TESTING TECHNIQUES TO DETERMINE STRUCTURAL PARAMETERS. AN OUTLINE FOR A POTENTIAL PHASE II EFFORT THAT WILL BUILD UPON THE PHASE I RESULTS WILL ALSO BE GENERATED.