Tooling-Free MMC Casting by Combining 3-D Printing of Ceram

Three-dimensional printed preforms will be used as mold patterns for MMCC's high-density, pressure resistant, castable refractory. Hard tooling will be eliminated from the Advanced Pressure Infiltration Casting process (APIC ). Cost for Al/Sic electronic housings will be slashed 75% over conventional pressure casting. Complex parts will be easily manufactured. Design modifications can be quickly incorporated. Design to commercial manufacturing time can I be reduced to weeks. Manufacturing rates will match powder injection molding I and die-casting. Specifically, we will develop high-density, pressure-resistant investment compounds that utilize 3DP preforms as mold patterns. Pattern coatings that result in high quality cast surfaces will be investigated. Pressure infiltration casting will be refined and used to manufacture thermo physical mechanical test coupons and prototype parts. The principle goals of the program l are: 1) develop mechanical and thermo p ysical properties equivalent to or better than legacy properties, and 2) verify the cost advantage of this approach. MMCC will collaborate with the Rapid Prototyping Laboratory at MIT to develop and manufacture SiC preforms for structural as well as electronic thermal management applications. For proof-of-concept, advanced microwave receiving amplifier modules for Lockheed-Martin/Sanders, and 2-pack second-stage compressor vane segements for the P&F- 119/JSF, will be prototyped.