Multi-Level Modeling and Simulation for Signal Integrity

With the increasing demand for higher component density and higher source frequencies in electronic circuits, the requirements for signal integrity and electro-magnetic compatibility have become paramount. Although some solutions exist for simpler packaging and signal integrity problems, the more challenging issues are the design, computational analysis and testing of piece-parts and systems. Revolutionary and integrated computer-aided design (CAD) tools are needed to address system level modeling and simulation problems of unprecedented size and complexity. Nondestructive test methods must also be developed for packages and interconnects, especially at the VLSI submicron level.The purpose of this research is to initiate the development of a system level CAD tool that permits a flexible transition from electromagnetic-level simulations to circuit analysis with an emphasis on signal integrity. This tool will include the means to perform an electromagnetic analysis of individual circuit components as well as the ability to model and simulate higher-level macromodels. Successful completion of the proposed research will improve the design and packaging of complex systems by means of flexible multi-level simulations. Such a tool or combination of tools will help unify electromagnetic analysis with circuit theory to provide a more graphical and flexible circuit analysis toolset.