SBIR/STTR Research Award

HEMT and HBT Process Design

Award identifier 3c1a1cf46376ac13c1b13fc8182e9a691ef1944ff05780e90731196acfbc926cAwarding agency Department of Defense · Air Force

Award amount

$313,952

Program and phase

SBIR · Phase II

Award year

1996

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Award details

Awarding agency
Department of Defense
Branch
Air Force
Recipient company
Gateway Modeling, Inc
Proposal award date
Not reported
Contract end date
Not reported
UEI
Not reported
Solicitation number
Not reported
Topic code
Not reported

Research abstract

This effort will address five problems in the process design of heterojunction bipolar transistors (HBTs) and high electron mobility transistors (HEMTs): (1) HEMT thermal impedances will be measured using a novel method and will be compared with finite-element simulations to provide more accurate values for computer-aided design programs. (2) The role of the spacer layer in HEMT performance and noise figures will be investigated. (3) HEMT source and drain resistances will be measured for a variety of spacings to assess different models and to determine critical resistance parameters. (4) Temperature-dependent large-signal device model parameters will be extracted for Wright Laboratory's thermal-shunted HBTs. (5) Room temperature model parameters will be extracted for a large number of HBTs in order to analyze HBT uniformity.

Technology keywords

Not reported

Agency intelligence

Department of Defense

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