ASSAY FOR NONMYELOSUPPRESSIVE ANTIINFECTIVES

Not Available k Technology Corporation (kTC) proposes to develop a unique 3D packaging configuration with high conductivity (> 900 W/mK), low coefficient of thermal expansion to match silicone or gallium arsenide, and low density (< 2.8 g/cm(sup 3)). This material can provide efficient conductive heat removal of the 3D segments for space, airborne and ground applications. The high conductivity and low CTE of the proposed material is ideal for many advanced packaging configurations such as multichip modules, high power processor integrated circuits and power converters. As in the rest of the electronics world, the range of applications and functions of spaceborne electronics is rapidly expanding. New applications like cellular phone systems, satellite TV links, and Global Positioning Units, as well as new technologies like multichip modules have increased the technical requirements of the electronics on satellites. Mission sophistication has increased dramatically for both commercial and government satellites, alike. Power requirements of a typical satellite launched even a few years ago were less than 8 kilowatts. Current systems will be deployed with up to 15 kilowatts. The proposed 3D packaging configuration uses a material system comprised of thermal pyrolytic graphite (TPG) encapsulated within the metal matrix composite AlSiC. Immediate payoffs include improved thermal performance, and significant weight reductions. These payoffs will allow for increased reliability and support