Conformal High Density Interconnects

Miniaturization of electronic packaging creates new product opportunities and enhances the performance of existing products. New fabrication approaches that allow more densely packaged electronics are needed. High density interconnects that conform to the shape of a product would take advantage of the naturally available space in smart weponry, spacecraft, personal communication devices and handheld computers. Omicron will characterize the materials and processes necessary to produce a conformal high density interconnect. Moldable plastic materials will be explored as interconnect substrates. Metalization and dielectric inner layer materials and will be defined. Methods for production of vias will be developed. Imaging techniques applicable to three dimensional circuitry such as laser direct write and conforming mask technology will be defined. Minimum conductor width/spacing/thickness and imaging speeds will be determined. ANTICIPATED BENEFITS: Conformal high density interconnect technology will allow more densely packaged electronics in handheld computers, smart weaponry, personal communication devices, and space craft. Reduced payloads and increased system performance will be seen in military and space applications. New market opportunities for handheld computers, sensors, and medical devices will be created.