Micromachined, Three-Dimensionally Integrated RF or RF-Optoelectronic Circuit Components

"The objective of this Small Business Technology Transfer (STTR) project is to develop novel high performance three-dimensionally integrated package designs for optical modulator applications. There are many optoelectronic device designs that show greatpromise in the research lab, but have demonstrated degraded response once packaged. The proposed effort will develop advanced packaging methods that are complementary to chip-level electronic and photonic packaging. In the Phase I feasibility study, theconcept of the three-dimensionally integrated package will be explored through computer simulations. Since there is an ongoing effort on the experimental demonstration of the packaging concept for VCSEL arrays, in Phase I we will also investigate thelikely issues that may arise when extending the concept to optical modulators. Among these, we will place special emphasis on the optical fiber connection to the silicon optical microbench. The complete device and package designs will be carried out in thePhase II continuation of the project. The proposed STTR effort will introduce a new generation of high performance package designs for optoelectronic devices. The concepts and designs will be applicable to a wide range of components beyond opticalmodulators. The outcome of the project will have a major impact on high speed optical communication systems for both military and civilian communications."