Advanced Packaging Concept for High Temperature Silicon Carbide Power Modules (kTC P214)

Operation at high power density and high temperature is a means to reduce the size and weight of power converters. Studies have shown that the volume of a power converter cooling system can be reduced by a factor of 5 through high temperature operation.Additional gains in system power density can be achieved by operating power modules at high frequency and high power density. Packaging development leading to improved thermal performance is essential to achieve increased power density, temperature andfrequency. k Technology Corporation (kTC) proposes to develop a passive integrated high performance electronic package configuration which will optimize the heat transfer from the active silicon carbide (or silicon) device to the cooling fluid. Byminimizing the temperature rise through the package, the coolant temperature can be maximized, and therefore the heat exchanger's size can be minimized. The proposed package material has high conductivity (> 1000 W/mK), low coefficient of thermalexpansion (7 to 9 ppm/K), and low mass density (< 2.6 g/cm3). In the Phase I, program kTC will demonstrate the feasibility of the proposed packaging concept through the design, fabrication, and evaluation of a candidate package. The packaging concept tobe demonstrated under this program would have applications in the commercial power generation market, as well as the obvious military and NASA uses. Key potential post application relies heavily on the successful verification and certification of theproposed materials' performance. With increasing acceptance, the technology will be attractive to automotive and power supply manufacturers. Enabling technologies will allow the increase of production and the realization of the economies of scale.