SBIR/STTR Research Award
Development of Inovative Flex and Rigid-Flex Interconnection Technologies
Award amount
$63,975Program and phase
SBIR · Phase IAward year
2002Award details
- Awarding agency
- Department of Defense
- Branch
- Missile Defense Agency
- Recipient company
- Rigid-Flex International, Inc.
- Proposal award date
- Not reported
- Contract end date
- Not reported
- UEI
- Not reported
- Solicitation number
- Not reported
- Topic code
- Not reported
Research abstract
Rigid-Flex circuits are a hybrid construction consisting of rigid and flexible substrates laminated together into a single package and electronically interconnected by means of plated through holes. Rigid-flex parts are normally multilayer designs butdouble sided constructions are possible as well. An infinite number of combinations and configurations are possible with the use of this type of interconnection device. Develope innovative flexible and rigid-flexible electronic interconnect devices toupgrade and improve existing electronic systems and equipment. These technologies will streamline production costs and greatly improve system reliability.
Technology keywords
Not reported