Low Cost Laser Diode Packaging Demonstrated in a Multi-Element Fiber-Coupled Laser Array

"Eighty percent of the cost of high volume optoelectronic components are in the package" according to Bob Weissman of HP (Optics News, Aug 1993). To allow laser diodes to serve various markets, cost is a primary consideration. Given their present relatively high cost, laser diodes are not economical in many systems. The present high fabrication cost of laser diode sources is caused mainly by the cost of packaging, because of the variety of packages needed for each diode and application. In this proposal, SDL will utilize an economical universe packaging technology based on a versatile micro optical bench fabricated in silicon. The silicon optical benches can be fabricated at low cost and are easily adapted to many laser diode sources; the number of packaging components is greatly reduced and the resulting package is smaller and more robust. In Phase I of the program SDL will investigate the feasibilitgy of the technology by demonstrating the coupling of a laser diode to a single mode waveguide. In Phase II, the research will be extended, among others, to an individually addressable fiber coupled laser array on a Si optical bench. Merging existing laser diode technology and Si optical benches lowers individual unit cost and permits the use of laser diodes in a variety of useful commercial systems. Anticipated Benefits: The proposed Si optical bench technology will lead to an across the board reduction of cost of packaged laser diodes for markets including telecommunications, data storage, displays, sensing, printing, cutting and welding and medical lasers.