Advanced Packaging Technology for RF MEMS

XCom Wireless is a developer of RF MEMS relays, high-performance components that have been identified as a critical technology for the next generation of defense and commercial electronics. The XCom Wireless process for developing RF MEMS provides adirect alternative to solid-state devices so communications and radar equipment manufacturers can easily upgrade to this technology, saving weight, space, power, and money. The proposed program is to develop a modular relay and subsystem packagetechnologies for RF MEMS devices, and demonstrate advances in manufacturing that can lead to a low-cost, high-performance integrated solution. The packages developed in this program will be generalized for RF MEMS, with specific application forOhmic-contact relays under operating conditions of interest to Defense needs. Relay prototype design, fabrication, and testing will be performed throughout the program, to develop incremental and combined process solutions to technical development issues,and to maximize the probability of securing Phase III commercialization interest. The design strategy of stacked assembly with RF MEMS promises true low-cost and rapid manufacturing potential for applications of any frequency, function, or volumes ofsubsystems delivered, and is believed to be an effective solution to the specialized, high-performance Defense needs.