POLYMER MATRIX COMPOSITE HEAT SINKS FOR ELECTRONIC DEVICES

METALLIC HEAT SINKS HAVE SERIOUS LIMITATIONS DUE TO HIGH DENSITY AND HIGH COEFFICIENT OF THERMAL EXPANSION CHARACTERISTICS. IT IS PROPOSED TO OVERCOME THESE PROBLEMS BY DEVELOPING COMPOSITE HEAT SINK MATERIALS BASED ON CRYSTALLINE GRAPHITE FIBERS, FILLERS, AND FOAMS HAVING HIGH THERMAL CONDUCTIVITIES, LOW COEFFICIENTS OF EXPANSION, AND LOW DENSITIES. THE RESULTING COMPOSITES BASED ON THESE MATERIALS AND CONVENTIONAL ORGANIC POLYMERS ARE EXPECTED TO COMBINE ADEQUATE THERMAL CONDUCTIVITY CHARACTERISTICS, GOOD MECHANICAL PROPERTIES, AND COEFFICIENTS OF THERMAL EXPANSION MATCHING CERAMIC MICROELECTRONIC COMPONENTS.