Shadow Moire System for Large Area Substrate Thermal Deformation Measurement

Electronic Packaging Services (EPS) proposes to develop a commercial instrument for the experimental measurement of out-of-plane thermal displacements for large area electronic substrates. The system will be based on shadow moire, a full-field non-contact optical technique. Phase stepping analysis, which convolutes multiple moire fringe images with fixed phase differences between them, extends the resolution in out-of-plane displacement measurement below 0.1 mils, automatically identifies contour maxima and minima, and reduces interference from permanent optical features. The sample will be held within an oven combining radiant and convective heating to allow computer-controlled simulation of a variety of manufacturing and testing processes. This project is an extension of analytical services currently provided by EPS to electronics manufacturers. The Phase I objective is construction of a full-scale laboratory prototype. Specific technical aims include scaling equipment to 24" x 24" sample areas,increasing speed and robustness of automated analysis algorithms, demonstrating uniform temperature control over large samples, and identifying useful reporting formats for out-of-plane displacement information.