Ultralightweight High Thermal Conductivity Constraining Cores for Multilayered Printed Wiring Boards

The objective of this project is to develop an ultralightweight high thermal conductivity printed wiring board (PWB) constraining core mad of very high thermal conductivity carbon materials to replace currently used material constraining cores, e.g. copper-invar-copper. The objective of Phase I is to show the feasibility of such a development. AMT will be supported by Honeywell Space Systems Operations (HSSO), B.F.Goodrich (BFG), and ROI in Phase I wherein: HSSO will provide requirements for constraining cores as well as drawings and configurations of existing metal cored PWB designs; AMT will conduct laminate analysis and develop material designs for the candidate materials, i.e., carbon-carbon and carbon brick, clad or infiltrated with copper, AMT will conduct a thermal performance analysis of the PWB; flat panels of copper clad carbon-carbon and carbon brick and copper infiltrated carbon brick will be purchased from POI and BFG; material property tests will be conducted on coupons from the panels; HSSO will conduct a brassboard demonstration of the performance of a five layer non-component PWB with two carbon copper constrainingf cores; AMT will identify the key development issues and develop a Phase II plan which includes approaches to resolving these key issues.