PIBO Film Dielectric for Advanced Microelectronics Packaging

This proposal is the result of the successful completion of a Phase I program of the same name (contract F33615-01-M-2174). The purpose of this program is to extend that research and development program into the birth of an enabling new technology andproduct.Polyimidebenzoxazole (PIBO) film is a new, self-reinforced, low dielectric constant, low CTE (coefficient of thermal expansion) film with a high level of thermal dimensional stability that perfectly matches the needs for next generation multilayer rigidprinted wiring board (MLPWB) dielectric substrates and packaging of integrated circuits. The properties of PIBO film will help to overcome many of the limitations of currently available materials that limit the reliability of area array (BGA, CSPs, FlipChip) packaging systems. Electronics products in applications including mobile commications, work stations, small computers, automotive controls, and aerospace and military weapons systems are moving relentlessly toward smaller, thinner, and lighterformats in lower cost packages. Interconnect density requirements in these products is rapidly outstripping that which is achievable through fabrication of traditional printed wiring boards derived from currently available materials.A specific application for PIBO film as the dielectric substrate for a complex PWB as the control board for the Joint Strike Fighter engine program has been identified. This is an important application for the Air Force and Navy. An industrial partnerhas taken an option to license PIBO film technology. They are currently devoting significant internal resources to explore the potential for this product for microelectronics and other applications. The potential for this product in just high-end PWBs isestimated at $60 million/year by 2007.