SBIR/STTR Research Award

A Novel Thermal Management Method for SiC Power Electronics

Award identifier 0256582c5cff3b8b14c0916dee2b569f67e7c8d832a373205ae50fb1918e1e47Awarding agency Department of Energy

Award amount

$99,955

Program and phase

SBIR · Phase I

Award year

2005

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Award details

Awarding agency
Department of Energy
Branch
Not reported
Recipient company
ADVANCED THERMAL ENVIRONMENTAL CONCEPTS LTD
Proposal award date
Not reported
Contract end date
Not reported
UEI
H2LVM1ZDX6R5
Solicitation number
DE-FG01-04ER04-33
Topic code
29 a

Research abstract

79237 Although solid-state power modules are becoming increasily important components in energy systems (e.g., wind turbines) and in vehicle propulsion systems (e.g., hybrid vehicles), the requirements for these power modules are beginning to exceed the limits of silicon-based power modules. Therefore, a switch to silicon carbide power modules, which can operate at higher operating temperatures and higher power loads, is critical to the deployment of many of these energy and vehicle systems. However, in order to take full advantage of the higher performance of silicon carbide power modules, new packaging and thermal management schemes will be required. This project will develop a novel packaging approach for silicon carbide power modules, which will not only improve thermal management but also allow the production of smaller, higher current, higher frequency power modules. By eliminating many of the interfacial layers currently used in silicon power modules, the approach also will improve manufacturing yield and operating reliability. In Phase I, the feasibility of the packaging concept will be demonstrated by assembling a silicon carbide die-ceramic cold plate, measuring its thermal resistance, and monitoring its thermal behavior during thermal cycling of the package. In Phase II, a complete silicon carbide power module, employing the new packaging will be fabricated and tested. Commercial Applications and Other Benefits as described by the awardee: The largest short-term commercial market is in the packaging of emerging SiC power modules. In addition major potential markets for power electronics include variable speed motor drives for hybrid vehicles ($12 billion annually), uninterruptible power suppliers ($5 billion annually), power supplies for computers and instruments ($11 billion annually), and distributed power (which includes inverters for photovoltaic and fuel cells, engine generator sets, wind and hydro turbines, welding power suppliers, industrial power supplies for metal and glass plating and coating; and lighting ballasts).

Technology keywords

Not reported

Other awards by this recipient

Verified by the same UEI. These are other public SBIR/STTR award pages, not a merged company record.

Awards with the same topic code

Verified by an exact topic code match. This is not a text-similarity match.

Research funding history

28 SBIR/STTR records share this UEI (1999–2013). Reported award amounts total $7,601,547. Reported amounts are not federal obligations.

Phases: Phase I, Phase II

Agencies: Department of Defense, Department of Energy, Department of Agriculture, National Aeronautics and Space Administration

Agency intelligence

Department of Energy

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