Development of Nonpolluting Soldering Technology for Large Production Volume, high Shock Loaded Electronic Circuit Boards

The soldering and cleaning processes used in the electronic industry are not environmentally friendly. Approximately 25% of the 50,000 tons of lead, bismuth and other toxic metals used in the soldering process for electronic assemblies are lost into the environment. Rosin based fluxes require solvent degreasing which release considerable amounts of hazardous chemicals into the environment. New, cost effective, environmentally friendly and reliable electronic assembly processes based on renewable and recyclable resources must be developed to maintain global competitiveness. Conax Florida Corporation (Conax) with Computing Devices Internationa as a subcontractor proposes to develop a "friendly" soldering process which will produce solder joints of high reliability in a high production military or commercial environment, without the use of toxic products. In Phase I, research into non-polluting and non-chlorofluocarbon based soldering processes/material will determine the technologies best suited for large scale production of printed circuit boards required to sustain very high stock enviornments. Semi-aqueous cleaning with residue capture and cleaning elimination will be considered. In addition, preliminary research already patented by Conax and Computing Devices International will be utilized to ensure that these environmentally friendly processes will allow continued use of current equipment with only minor modifications.